Electronic stickers to streamline large-scale ‘internet of things’

Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

Go to Source

(Visited 3 times, 1 visits today)

Site Footer

Sliding Sidebar